Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels

SEMI OpenIR > 中国科学院半导体研究所（2009年前）

	Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels
	Chen HD; Liang K; Zeng QM; Li XJ; Chen ZB; Du Y; Wu RH; Chen HD Chinese Acad Sci Inst Semicond State Key Lab Integrated Optoelect Beijing 100083 Peoples R China.
	2000
会议名称	Conference on Semiconductor and Integrated Optoelectronics
会议录名称	IEE PROCEEDINGS-OPTOELECTRONICS, 147 (1)
页码	2-6
会议日期	1999
会议地点	CARDIFF, WALES
出版地	MICHAEL FARADAY HOUSE SIX HILLS WAY STEVENAGE, HERTFORD SG1 2AY, ENGLAND
出版者	IEE-INST ELEC ENG
ISSN	1350-2433
部门归属	chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china; hebei semicond res inst, shijiazhuang 050051, peoples r china
摘要	Hybrid integration of GaAs/AlGaAs multiple quantum well self electro-optic effect device (SEED) arrays are demonstrated flip-chip bonded directly onto 1 mu m silicon CMOS circuits. The GaAs/AlGaAs MQW devices are designed for 850 nm operation. Some devices are used as input light detectors and others serve as output light modulators. The measurement results under applied biases show good optoelectronic characteristics of elements in SEED arrays. Nearly the same reflection spectrum is obtained for the different devices at an array and the contrast ratio is more than 1.2:1 after flip-chip bonding and packaging. The transimpedance receiver-transmitter circuit can be operated at a frequency of 300 MHz.
关键词	Mqw Modulators Effect Device Progress Circuits Cmos
学科领域	光电子学
收录类别	CPCI-S
语种	英语
文献类型	会议论文
条目标识符	http://ir.semi.ac.cn/handle/172111/15003
专题	中国科学院半导体研究所（2009年前）
通讯作者	Chen HD Chinese Acad Sci Inst Semicond State Key Lab Integrated Optoelect Beijing 100083 Peoples R China.
推荐引用方式 GB/T 7714	Chen HD,Liang K,Zeng QM,et al. Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels[C]. MICHAEL FARADAY HOUSE SIX HILLS WAY STEVENAGE, HERTFORD SG1 2AY, ENGLAND:IEE-INST ELEC ENG,2000:2-6.

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